Gold ball wire bonders
le to ensure that solder joints on both sides of the two lines are basically the same, and because the chip stand on the spot parameters are different, select the chip with a different bracket welding power, guaranteed spot on the chip and stand up on the ball a welding requirements are met. ● burning ball performance greatly improved, if more using our unique design of the chopper, get a smaller solder (solder ball) and the more reliable two welding. More suitable for blue, Bai Faguang diode p
6/7 صفحة الآتي صفحة السابقة الصفحة الرئيسية صفحة النهاية
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التجديد
WAP الرئيسية
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08/27 05:53