Dow Corning OE-8001 adhesives bond better than the traditional solid organic silicon adhesive, epoxy thermal stability than traditional chips.
Dow Corning launched last week-one thermosetting resin, poly methyl silicone adhesive - OE-8001 chip bonding agent, specifically for LED (light emitting diode) manufacturing.
Dow Corning OE-8001 adhesives bond better than the traditional solid organic silicon adhesive, thermal stability is better than the traditional epoxy chip bonding agent. This adhesive is designed for pin transfer of technology developed to help improve the operability of the construction process. It changes the viscosity at room temperature lower, so more convenient operation.
It is understood that, compared with other organic materials, organic silicon in the case of increasing temperature remain light transmission. The use of the material of the LED products will have good and excellent light transmission of durability.
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